spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 1 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 description the blue source color devices are made with ingan light emitting diode. static electricity and surge damage the leds. it is recommended to use a wrist band or anti-electrostatic glove when handling the leds. all devices, equipment and machinery must be electrically grounded. applications z traffic signaling. z backlighting (illuminated adver tising , general lighting). z interior and exterior automotive lighting. z substitution of micro incandescent lamps. z reading lamps. z signal and symbol luminaire for orientation. z marker lights (e.g. steps, exit ways, etc). z decorative and entertainment lighting. z indoor and outdoor commercial and residential architectural lighting. 2.2x1.4mm surface mount led lamp part number: aa2214qbs/d-amt blue features z high reliability led package. z 2.2mm x 1.4mm, 1.3mm high. z low power consumption. z available on tape and reel. z package : 2000pcs / reel. z moisture sensitivity level : level 3. z rohs compliant. package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.2(0.008") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications. attention observe precautions for handling electrostatic discharge sensitive devices
spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 2 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry. 4. the outer diameter of the smd pickup nozzle should not exceed t he size of the led to prevent air leaks. the inner diameter of the nozzle should be as large as possible. 5. a pliable material is suggested for the nozzle tip to avoid scratching or damaging the led surface during pickup. 6. the dimensions of the component must be accurately progra mmed in the pick-and-place machine to insure precise pickup and avoid damage during production.
spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 3 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 selection guide notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity/ luminous flux: +/-15%. electrical / optical characteristics at t a =25c absolute maximum ratings at t a =25c notes: 1. rth(j-a) results from mounting on pc board fr4 (pad size 16 mm 2 per pad), 2. 1/10 duty cycle, 0.1ms pulse width. part no. dice lens type iv (mcd) [2] @ 20ma v iewing angle [1] code. min. max. 2 1/2 aa2214qbs/d-amt blue (ingan) water clear m 80 120 120 n 120 200 p 200 300 notes: 1.the dominant wavelength ( d) above is the setup value of the sorting machine. ( tolerance d : 1nm. ) 2. forward voltage: +/-0.1v. parameter symbol value unit code. min. typ. max. wavelength at peak emission i f =20ma peak 468 nm dominant wavelength i f =20ma dom [1] nm 1b 461 468 2a 464 471 2b 467 473 3a 469 475 3b 471 477 reverse current (v r = 5v) i r 50 ua spectral bandwidth at 50% rel max i f =20ma ? 25 nm forward voltage i f =20ma v f [2] - 3.3 4.0 v temperature coefficient of peak i f =20ma, -10 c t 100 c tc peak 0.05 nm/ c temperature coefficient of dom i f =20ma, -10 c t 100 c tc dom 0.03 nm/ c temperature coefficient of v f i f =20ma, -10 c t 100 c tc v -2.5 mv/ c parameter symbol value unit power dissipation p d 120 mw junction temperature t j 110 c operating temperature top -40 to + 1 0 0 c storage temperature ts t g -40 to + 11 0 c dc forward current[1] i f 30 ma peak forward current [2] i fm 150 ma electrostatic dischar ge threshold (hbm) 250 v thermal resistance (junction/ambient) [1] r th j-a 250 c/w reverse voltage v r 5 v
spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 4 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 blue aa2214qbs/d-amt
spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 5 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 aa2214qbs/d-amt reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. recommended soldering pattern (units : mm; tolerance: 0.1) reel dimension tape dimensions (units : mm)
spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 6 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 packing & label specifications aa2214qbs/d-amt
spec no: dsal4009 rev no: v.1 date: nov/22/2010 page: 7 of 7 approved: wynec checked: allen liu drawn: c.h.han er p: 1201007405 failure criteria items symbols conditions failure criteria luminous intensity lv i f = 20ma testing min. value |
